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Intel McKinely™ Folded Fin
This Intel Itanium™ based passive folded fin heatsink is designed with a Ni plated Cu fin/Cu base. The design incorporates an aluminum shroud attached to the base. The heatsink weight is 600 grams with an envelop dimension of: 100.0mm-L x 71.0mm-W x 44.1mm-H. The attachment hardware is design captive to the heatsink base and is ready to mount to the retention mechanism. Thermal interface material can be applied per customer request.
Heatsinks - BGA