This Intel Xeon™ based passive folded fin heatsink is designed with an Al fin/Al base. The design incorporates an aluminum shroud attached to the base. The heatsink weight is 295 grams with an envelop dimension of: 88.9mm-L x 63.5mm-W x 50.8mm-H. The attachment hardware is ordered separately. Thermal interface material can be applied per customer request.