 | Radial
Radial fin style provides unique cooling solutions for BGA semiconductor packages. An exclusive heat sink attachment method allows for quick, clean and replaceable mounting. Note: Mounting clip does not increase overall Heat Sink height. All Radial Heat Sinks can be customized to meet your design requirements.
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| Tyco PN | 2-1542003-2 |
| Package Size | 23 mm (0.91 in) |
| No. of Fins | 2 |
| Diameter | 34.92 mm (1.37 in) |
| Height | 9.06 mm (0.36 in) |
| Power | 5,10,15 Watts |
Thermal Resistence
5W @ 0LFM | 13.43 |
Thermal Resistence
5W @ 200LFM | 7.22 |
Thermal Resistence
5W @ 400LFM | 4.85 |
Thermal Resistence
5W @ 600LFM | 4.05 |
Thermal Resistence
10W @ 0LFM | 12.23 |
Thermal Resistence
10W @ 200LFM | 7.08 |
Thermal Resistence
10W @ 400LFM | 4.67 |
Thermal Resistence
10W @ 600LFM | 3.96 |
Thermal Resistence
15W @ 0LFM | 11.26 |
Thermal Resistence
15W @ 200LFM | 7.24 |
Thermal Resistence
15W @ 400LFM | 4.70 |
Thermal Resistence
15W @ 600LFM | 3.92 |
| Material | Aluminum |
| Finish | Black Anodized |
| Flame Rating | UL94-V0 |
Thermal Resistence Chart |
