Industry's first compact BGA socket engineered for test, development, and production applications. Instead of soldering devices to the motherboard, Advanced's unique design allows BGA devices to be placed onto mating contacts. The patent-pending pressure retention clamp, with integral heat sink, slides easily onto the BGA socket assembly, ensuring a reliable and consistent connection.

• No soldering of the BGA device required.
• Same footprint as BGA device.
• Compact, low-profile design maximizes PC board space and requires no external hold-downs.
• Available with integral, finned heat sink or coin-screw retention clamp.
• Surface mount and thru-hole designs available.