Reliable solution for mounting or socketing LGA or re-worked BGA devices.

• Maximizes PCB real estate - only 2mm larger than LGA or BGA device
• Custom designs available
• Available in hundreds of footprints
• Eutectic solder balls provide superior solderability
• Available in 0.80mm (.0315"), 1.0mm (.039"), and 1.27mm (.050") pitch
• Brass, Copper Alloy (C36000), 63Sn/37Pb Solder Ball, Eutectic, 183°C (361.4°F)
• Gold over Nickel
• FR-4 Glass Epoxy, U.L. Rated 94V-0