An economical and reliable alternative to soldering BGA devices directly to the motherboard, the Advanced® molded BGA Socket Adapter System enables the BGA device to be plugged into a mating socket after soldering to a pinned adapter. Low insertion force, patented design provides yields that are equivalent to direct attach, with coplanarity consistently better than the industry standard of .006" (0.152mm).

• Protects valuable PC boards and subjects device to lower thermal stress.
• Same footprint as BGA device.
• Multi-fingered, high reliability contacts and screw-machined terminals for superior reliability.
• Value-added features such as eutectic solder balls, solder preforms, kapton seal and tape and reel packaging reduce processing and application costs.